深圳市深科特电子技术有限公司-专业PCB(线路板)抄板,PCB改板,PCB设计,原理图设计,LAYOUT板,BOM表制作,线路板,PCB板,埋盲孔板,PCB,电路板,单片机解密
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专业PCB(线路板)抄板,PCB改板,PCB设计,原理图设计,LAYOUT板,BOM表制作,线路板,PCB板,埋盲孔板,PCB,电路板,单片机解密
 
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Our company can offer PCB to the masses of customers and copy the board,change board,PCB design,principle picture make, BOM from make, chip decipher and PCB Produce ,stick toscenes of processing a connected sequence.our aim: "QUALITY FIRST,THE CUSTOMER IS THE HIGHEST"we will do the best service for you...
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PCB Types Involve The Products Class Decipher
Accurate pair of panels
4-38 layers of much plywood
count and tet into the blind hole,bury the hole board
1-7 steps of laser blind hole boards
The laser is buride a board
UItra-high frequency board(above 10GHz)
PCB Produces in batches
NetWork:EnternetSwitchboard、Route implement
Data communication:VOIP、xDSL、Switch in a server
Computer product:Server host stiff、Video card
Multi-media product:LCDdisplayhost stiff
Wireless product:Mobile telephone board , base stand equipment
The labor charges board:Every series labor charges board
Beginning the Circuit-tech Electronic had been established from 2000,has set up own chip decipher and the monolithic integrated circuit software development team,in 2002 officially had been established the chip decipher department(all decipher service to limit the ...
 
PCB Copies the board   
· Copy the board accurately
· Flights of capacity
· Departments visit
· Copy the board proceduce
· Involve The Products Class
 Successful Case
· Case 1 26 of the communications boa
· Case 2 38 of space dashboard Ersans
· Case Sansanshisi layer air interfac
· April 6 cases of a band mobile phon
· Case May 8 layer board PHS band las
· June 8 cases of a band mobile phone
· Case Control Board a one-time 72-Pr
· Case August 8 layer board Goldfinge
· September 4 cases of high-end graph
· Case 16-PC3200 DDR512M memory modul
Chip Declassified
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Produces in batches More
· Multi-layer circuit boards through holes in the micro-technology of the production
· FR-4 Substrate plate Analysis of shortcomings
· IPC PCB Standard Survey
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Place:Index >OEM production
Date:2008-6-30 15:04:29  Author:admin From:www.Circuit-tech.cn
(1) DRY (Dried Laminate) substrate dry --

     Analysis:: DRY is a very difficult problem, some degree of difference between serious cases of a comprehensive nature and dry, mild, occurred in the corners, there may be reasons for the coupling of glass cloth (Coupling Agent) and resin Compatibility of poor compliance of moisture (Wet Out, James of plastic) bad. In addition, the film also may be excessive sclerosis (Overcure) resin resulting pressure timely flow of bad, if we find that the plastic film flow (Resin Flow R / F ) Is low, it may be the precursor substrates dry, DRY in the welding of the substrate (Solderability) test easily layered (Delamination).

     Countermeasures:: If the glass cloth surface finish (Finish) of the issue, it is necessary to improve the supplier, if it is the low flow of plastic, to reduce any water legislation (Varnish) of the gel time (S / G), or raise Film The glue of time (P / G) and plastic content (R / C), and other aspects proceed. DRY if not serious, who can amend the conditions of pressure, such as heating rate increase, on the early pressure, increased pressure, However, this approach to treating the symptoms, effects and materials far from the adjustment and improvement more remarkable.

(2) WAC / WAE (White at Corner, White at Edge) white-white angle --

     Analysis: When the film of plastic flow (R / F) High or bad storage conditions and the absorption of water and gas, timely and easy to produce in the pressure-plastic (Press Flow) increased the situation. As film after the resin is heated Anisotropy (Anisortropic) from the central to the way the external proliferation, therefore, edge-glue, plastic water content (R / C) also will be low. When this part can not be totally avoided, will appear weave pattern - The white-white angle. Another possible reason is the warming rate too fast, resulting in each Book, the temperature difference between the outer layer of plastic and uneven flow, timely pressure slightly and a white slip of white-Kok. In addition, the Film Memory in many tiny air bubbles and plastic-(Microvoids), when the plastic flow (R / F) low, the bubble was only contingent rushed to board edge and could not escape board, we will also show white-and-white side angle.

     Countermeasures:: If the flow of plastic film (R / F) higher, the legislature may, by raising the water where the glue of time (S / G) or reduce the plastic film of the time (P / G) adjust the way. And the flow of plastic Also by the pressure of conditions to be amended (such as lower heating rate, the delay on pressure, etc.) as a result of R / F of the low-angle can change the white-Treating Spec (such as improving R / C, P / G) Or pieces of pressure (increased pressure to raise the pressure, increased heating rate, etc.) approach to solve.

(3) MCB (Microblister) micro-bubble --

     Analysis: MCB was mainly due to a slight bubble has not completely escaped and caused by the remnants on the board, when the use of non-vacuum pressure of the press timely, MCB often random distribution of the present situation. Such as the use of vacuum system, MCB only occur In the corners, with lines sometimes appear, such as regional too large can not be removed, put into WAC / WAE. In addition, if the vacuum system in a gas leakage or pressure conditions are not at that time, they have a low flow plastic case This will create MCB.

     Countermeasures: Treating conditions can be adjusted, such as improving R / C, P / G from the increased flow of plastic starting to improve. In addition, pressure can also change the operation of the cycle Cycle, such as increased pressure on the early pressure, such as heating rate increase Ways to overcome them.

(4) DEL (Delaminaton) stratified --

     Analysis: If the film because of lack of hardening or bad storage conditions, absorb too much water vapor pressure and timely and easy to produce large flow of plastic, resulting in R / C low and lower glass cloth and resin between the binding, final Work should be under the worship of the elements will evolve. In addition, the film hardening excessive pressure timely flow of plastic may also have a low-tiered, DRY reasons for this and similar.

     Countermeasures: as a result of excessive flow of plastic DEL caused by pressure can be adjusted to do with conditions (such as reducing pressure on the pressure to delay, reduce heating rate, etc.). As for, hardening over the layered, it must be changed by S / G, R / C, P / G, such as the direction to proceed.

(5) MSL (Measling) white point --

     Analysis: Perhaps because of pressure of the air bubbles in the film can not out, and appear opaque white spots. In addition, if the plastic film in R / C low, glass or plastic cloth itself become the Wet Out of bad, Jingwei yarn staggered in the node, prone to the phenomenon of missing and a plastic white spots. Another film will be produced as hardening less than white spots.

     Countermeasures: strengthening the pro-plastic glass cloth James plastic (Wet Out) effects, and improve the content of plastic R / C, as a result of hardening of the lack of white spots may also from time to address growth sclerosis.

(6) WEP / RSV (Weave Exposure / Resin Starvation) weave pattern revealed / lack of plastic --

     Analysis: This two for the symptoms rather similar, but different impact on the part of others. If it occurred on the surface, it may not be glass cloth complete coverage, while showing a weave pattern revealed patterns. Such as occurred in the middle of the house, will be a shortage of plastic local phenomenon.

     Countermeasures: because of R / F High pressure makes timely flow of plastic too large formation of WEP / RSV, may, by a pressure to adjust the conditions (such as lower heating rate, the delay on the pressure, reduce the pressure of, etc.). As for James plastic Wet Out of bad or R / C caused by the low WEP / RSV conditions required by the plastic on the amendment proceed (such as increased R / C, P / G, etc.).

(7) THK (Thickness) thickness from --

     Analysis: usually plastic substrates because of the confluence of pressure, often the thin edge of the plate Houer circumstances. But while still in the average thickness of the specifications. Film thickness due to depart from R / F, pressure timely flow of plastic, made of plastic (R / C) lower, thus the thickness formed on the low side. In addition, the film's composition is also the thickness of a considerable degree of influence, who wish to be the result of a certain thickness, the film of several kinds of cloth and there may be all kinds of different options, R / C also are differences, once the portfolio was not It's easy to deviate from the thickness.

     Countermeasures: plastic flow due to the excessive thickness of the low side, through the plastic on the conditions and the pressure of the operating cycle (Cycle) be adjusted. As a result of a combination of improper deviation from the thickness required by the experience and experiment and amendments.

(8) W / T (Warp & Twist) plate-bending Alice --

     Analysis: the rate of warming or cooling down too fast causing a substrate with stress (Internal Stress), this stress can not be fully released, easy to form W / T. When the use of non-vacuum pressure timely, in order to rush to complete bubble Out, usually used by the greater pressure and thus will have a relatively W / T. this point in the thin substrate (Thin Core) especially notable. In addition, the film again and again once the home of Jingwei wrong direction, the combination of improper use or deformation of steel, decking, Dianban, are likely to cause W / T.

     Countermeasures: up, cool down too fast and the W / T, may reduce the rate of temperature change, and further increases do, "Baking" (Post Bake), and other direction proceed. As for the composition of improper or steel plate caused by the deformation of the W / T, would address the reasons for the right individual, be improved.

(9) PND (Pits and Dents) Au points and depression --

     Analysis: PND is a substrate for all who have still not fully eradicate the fundamental problems. If any particles in the film due to static electricity by the absorption edge of the Fenxie, glue residue on the plate, the scale in the air and falling dust, debris and other residues of copper foil, as long as attached to the plate on the end there will be various forms and sizes The PND.

     Countermeasures: immediate and effective approach is to identify the plate and be re-grinding, washing on the line after the re-use. The fundamental solution is to minimize the contact and exposure to air time. Therefore, the home again and again, and the combination of copper foil crop, and so on, must be in a clean room automation manner.

     In addition, with the installation of the devices to eliminate static electricity, and the combination of home automation system again and again, transmission lines, and to maintain the cleanliness of the workplace, reducing Fenxie, the dust of the measures, all the way to reduce PND.

(10) DFM (Dirty Foreign Materials) foreign bodies, impurities --

     Analysis: Hot-air oven on the use of plastic on the industry in terms of, DFM is not totally eradicate, "never mind the pain," because in the transmission of the baking process, the residual glue often easy absorption in the oven wall, the oven's hot air exports Nozzle and wind pipe, a black-Xiao Heidian of carbide, if not completely removed, will be as hot air, landed on the film, in addition, the plastic area of any foreign body such as Wenying, glass fiber yarn, such as Fenxie Will be formed DFM.

     Countermeasures: DFM of the major reduction in the clean oven, including the oven wall, Nozzle, the wind of any dead ends have to note, in addition, again and again the home district officers to cooperate with Sorting, to single out a Xiaohei Dian, Fenxie, fiber Silk and other foreign body of the film.

(11) SLP (Slippage) slip --

     Analysis: When used in plastic film for the R / C High combination of scattered wood or plastic flow of R / F higher, the pressure of their cooperation in the industry easily slip phenomenon. In addition, if the temperature difference between inside and outside of each Book of much of the uneven flow of plastic is also the reasons for the slip. Each Book of the Book of the substrate and the bad location, will create slip.

     Countermeasures: If Film R / C or R / F High may, by a combination of change and adjustment to conditions on rubber, plastic flow can also be greater when the pressure of Cycle for the amendment (such as lower heating rate, the delay on the pressure, reduce too And so on). Book larger temperature difference between inside and outside, can also "by Zhang" middle way down to overcome, as for as long as the operation was targeted at the poor pay more attention can be improved.

(12) WKL (Wrinkles) copper foil wrinkles --

     Analysis: WKL most likely to occur in 1 oz following copper foil, as long as the staff in the process of laying copper foil slightly rough, it may have WKL. In addition, the flow of plastic film R / F partial result of high pressure timely flow of plastic will create too big WKL.

     Countermeasures: the formation of the laying of copper foil can be operated by personnel training and strengthening. As for the film R / F High flow or plastic may be too much pressure for Treating Spec and conditions to adjust.
 
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