ShenZhen Circuit-tech Electronic CO.,Ltd-通推出BCM2070单芯片蓝牙2.1+EDR方案

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通推出BCM2070单芯片蓝牙2.1+EDR方案

Date:2008-6-17 14:43:21　 Author:admin　From:www.Circuit-tech.cn

博通(Broadcom)新推出一款单芯片蓝牙(Bluetooth)2.1+EDR方案BCM2070，该组件采65nmCMOS制程与BroadcomSmartAudio音效与语音强化技术，过去，SmartAudio仅被运用在无线耳机上，现在则被用来改善手机的使用寿命和音频品质。

BCM2070单芯片整合了高效能的2.4GHz’Class1’蓝牙射频功能，支持2.1+EDR，只需使用小于25mm2的电路板设计空间；此外，它也比其它蓝牙方案节省高于四成的功耗需求。

Broadcom同时为BCM2070导入新的RF射频架构技术。此架构有助于改善接收灵敏度和传送的输出功率，进而确保行动电话与耳机产品之间有更佳的连结性。由于支持先进的A2DP蓝牙规格，新款芯片能让多个使用者同时收听串流的立体声音乐。

BCM2070中的音频强化技术包括Broadcom独特的遗失封包补偿(packetlossconcealment，PLC)技术，它能重塑音频串流，为遗失资料封包做补偿，进而提供更清晰的数字语音通讯效果。

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